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SHEAR BOND STRENGTH AND FAILURE PATTERNS ACCORDING TO THE THICKNESS OF RESIN BASE IN BRACKET BONDING

Korean Journal of Orthodontics 1998³â 28±Ç 4È£ p.659 ~ 668
±èÀçÇõ, ȲÇö½Ä,
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±èÀçÇõ (  ) - Àü³²´ëÇб³ Ä¡°ú´ëÇÐ ±³Á¤Çб³½Ç
ȲÇö½Ä (  ) - Àü³²´ëÇб³ Ä¡°ú´ëÇÐ ±³Á¤Çб³½Ç

Abstract


The purpose of this study was to evaluate the possibility of the decrease of bond strength due to increased thickness of resin base in indirect bracket bonding technique.
Metal brackets were bonded to the resin blocks involving bovine lower incisors and the thickness of resin bases was increased by increments of 0.5 mm from 0.0 mm to 2.0 nun. They were divided into two groups,¢¥ one group is that the thickness of resin base was increased but the loading point from the tooth surface was maintained constantly, the other group is that the loading point from the tooth surface and the resin base thickness were increased concomitantly. The shear bond strength was tested on universal testing machine and the failure patterns were assessed with the adhesive remnant index(ARI).

The results were as follows:

1. When the distance from the tooth surface to the loading point was maintained constantly, shear bond strength was increased significantly according to the decrease of distance from the bracket base to the loading point and the increase of resin base thickness.
2. When the distance from the tooth surface to the loading point and the resin base thickness were increased concomitantly, shear bond strength was decreased according to the increase of resin base thickness but significant differences were ignorable.
3. There were no significant differences in ARI scores according to the change in the thickness of resin base.
The results of the present study indicated that shear bond strength was not much affected by the thickness of resin base, whereas was decreased according to the increase of distance from bracket base to the loading point

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°£Á¢ºÎÂø¼ú½Ä;·¹Áø º£À̽º µÎ²²;micromanipulator;Àü´Ü°áÇÕ°­µµ;Á¢ÂøÁ¦ ÀÜ·ùÁö¼ö;Indirect bonding technique;Resin base thickness;micromanipulator;shear bond strength;ARI

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SCI(E)
KCI
KoreaMed